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Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

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Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

Name: Copper Circuit Board TiN Coating Machine MF Magnetron Sputtering System
Brand: ROYAL
Price: 1 USD

Wholesale Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System from china suppliers

Brand Name : ROYAL

Model Number : RTSP1215-MF

Certification : ISO, CE, UL Standard

Place of Origin : Made in China

MOQ : 1 set

Price : negotiable

Payment Terms : L/C, D/A, D/P, T/T

Supply Ability : 15 sets per month

Delivery Time : 8 to 12 weeks

Packaging Details : Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.

Vacuum Technology : MF Magnetron Sputtering, Ion Source Plasma Cleaning

Deposition Sources : Sputtering Cathodes

Coating Films : Metal film plating, Titanium Nitride, Titanium Carbide, Zirconium Nitride, Chromium Nitride, TiAlN, CrC

Industrial Applications : Electronics module, Circuit board, hard coatings, PVD decorations

Deposition Chamber : 8-sides chamber

Factory Location : Shanghai city, China

Worldwide Service : Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America

Training Service : Machine operation, maintenance, coating process Recipes, program

Warranty : Limited warranty 1 year for free, whole life for machine

OEM & ODM : available, we support tailor made design and fabrication

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Copper Circuit Board TiN PVD Coating Machine / PVD TiN Decorations Plating on Brass Board

The PVD machine model: RTSP1215-MF is designed and developed to deposit TiN gold coating on Copper circuit board. The TiN thin film generated in high vacuum environment, which highly enhanced the uniformity and purity.

Copper Circuit Board TiN PVD Coating Machine design features:

1. 8-sides chamber with equal sizes mounting flanges, which can assemble and exchange Ion source and Sputtering cathodes or Arc cathodes flexiblely based on the coating processes demand.

2. Compact design which only occupy 20sqm;

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. High pumping speed package and stable configuration, the magnetically suspension molecular pumps can be mounted in any direction.

Copper Circuit Board TiN PVD Coating Machine Specifications

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10^-⁶ Torr.

2. Operating Vacuum Pressure: 1.0×10^-⁴ Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10^-⁴ Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

RTSP1215-MF Technical Data
MODEL				RTSP1215-MF
TECHNOLOGY				Magnetron Sputtering (MF)
MATERIAL				Stainless Steel (S304)
CHAMBER SIZE				Φ1200*H1500mm
CHAMBER TYPE				8-sides, vertical, 1-door
SPUTTERING SYSTEM				4 sets Planar Sputtering Cathodes
DEPOSITION MATERIAL				Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel, Titanium, TiN
DEPOSITION SOURCE				4 Planar Sputtering Cathodes + Ion Source for Plasma cleaning
GAS				MFC- 2 ways, Ar, N2
CONTROL				PLC(Programmable Logic Controller) + Touch Screen
PUMP SYSTEM				SV300B - 1 set (Leybold)
				WAU1001 - 1 sets (Leybold)
				D60T- 1 set (Leybold)
				MGK3304 - 2 sets ( Osaka)
PRE-TREATMENT				Bias power supply: 1*36 KW
SAFETY SYSTEM				Numerous safety interlocks to protect operators and equipment
COOLING				Cold Water
POWER ELECTRICAL				480V/3 phases/60HZ ( USA compliant)
				460V/3 phases/50HZ ( Asia compliant)
				380V/3 phases/50HZ ( EU-CE compliant)
FOOTPRINT				L3000W3000H2000mm
TOTAL WEIGHT				7.0 T
FOOTPRINT				( LWH) 50004000 4000 MM
CYCLE TIME				30~40 minutes (depending on substrate material, substrate geometry and environmental conditions)
POWER MAX..				110KW
AVERAGE POWER CONSUMPTION (APPROX.)				50 KW

Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

Copper Circuit Board TiN PVD Coating Sample

Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

Product Tags:

tin coating machine

titanium coating machine

Copper Circuit Board TiN Coating Machine , MF Magnetron Sputtering System Images

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